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Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications

机译：前言特别节，关于构成高性能电子系统的互连，封装和设备的电气性能分析和仿真

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Canavero, Flavio; Franzon, P.D.;
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年度 2008
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正文语种 {"code":"en","name":"English","id":9}
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Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications

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